Variety Of Packaging Options
- Wide range of packages in QFN, LQFP, CSP
- Tested wafers, bumping, die in waffle pack, die on tape & reel
- Stacked die, MCM
Production Testing
- In-house mixed signal testing services at probe & package
- Package handler to reduce test time
- In-house temperature & speed testing
- In-house product characterization and engineering
- Well equipped lab including hot/cold temp chamber
- Characterization over military temp range
- RF & high pin count 3rd party test partners
MLM, MPW, Consignment, Die Banking
- Multi Layer Mask: Multiple masks per reticle to reduce NRE
- Multi Project Wafer: Shared masks & wafers to reduce NRE
- Die Banking: Shortened leadtime & lifetime extension
Quality
- ISO 9001-2000 quality flow
- MIL-STD-883 screening
- Qualification & burn-in (life test and burn in – in house)
- Local failure analysis (MEFAS/EAG)
The Industry Leader in RF,
Analog and Mixed-Signal ASICs
