Success Stories

Success Stories

Controller for 100G Optical Communications Transmission

Features

Heaters to thermally tune optical lasers
Controls transmit power laser
Numerous 12 & 14 bit DACs
High frequency, 12 bit accuracy pulse width modulated (PWM) output
50 ps resolution
Buck switching regulators
Die Size: 11.3 mm²
Package: Bumped Die
180 nm CMOS

Applications

Laser Control for Integrated Photonics used in Optical Communications Systems

application-1

Programmable Inductive Proximity Control

Features

Patented architecture based on LC tank oscillator
Senses all metal target at equal and longer sensing distance through phase detection or combined phase shift/amplitude sensing
High switching frequency
High level of magnetic field immunity
3 wire DC or 2 wire AC/DC interface
Key circuit blocks include oscillator, signal modulator, ADC, power management, short circuit protection, embedded microprocessor, SRAM and nvRAM memories.
Embedded processor controls various modes of operation, temperature compensation, sensor calibration, signal linearization, system diagnostics and output control
Embedded processor controls various modes of operation, temperature compensation, sensor calibration, signal linearization, system diagnostics and output control
Die Size: 4.8 mm²
Package: 24 lead 4mm x 4 mm QFN
180 nm BiCMOS

Applications

Industrial Automation
Robotics

application-2

Signal Processor

Features

Highly phase stable, low noise continuous time filters
Low Noise instrumentation amplifiers (~2 nA/rt Hz, 14 bit accuracy)
Precision TIAs
Sigma-Delta Modulators
Pipeline ADCs – 14 bit (4 MHz), 12 bit (6 MHz)
Low noise reference
Control logic including SPI port
Ultra low Power: ~150 mW
Die size: 18.1 mm²
Package: 104 pin BGA
180 nm BiCMOS

Applications

Video Systems
Imaging

High Speed Transmitter/Receiver Chipset

Features

Very low noise TIA
Differentiator
Hysteresis comparator with LVDS differential output
IR diode driver
Power monitor with TIA, peak detection, integrator and 8 bit ADC
RSSI indicator with variable pulse width output
Control logic including SIO port
Die size: 1.0 mm² each
Package: 24 lead QFN
180 nm SiGe BiCMOS

Applications

Sensing
Imaging

RF Transceiver

Features

28 GHz electro-absorption modulator driver
Proprietary linear architecture
Industry’s lowest power consumption
Output Swing: 2 Vpp @ 28 GHz
28 GHz transimpedance (TIA) amplifier receiver
Ultra-low power
Transmitter and Receiver of NRZ data
Die Size: 3.1 mm²
Package: Bumped Die
180 nm SiGe BiCMOS

Applications

Integrated Photonics for 100G Optical Communications

Multi-Channel Driver

Features

8 driver channels
On-chip wireless receiver; detects data and generates chip power
On chip power management circuity including RF receiver and 900 MHz full wave rectifier used to generate power supply
Control logic
Die Size: 2.8 mm²
Package: Bumped Die
600 nm CMOS

Applications

Neuro Stimulation for Pain Relief

Rotary Hall Sensor

Features

Measures angular movement
Multiple Hall Sensors
Proprietary sensing circuitry/hall sensor arrangement
14 bit ADC
LDO
12 bit DAC
Customer DSP
Programmable memory
PWM output
Die Size: 3.4 mm²
Package: 16 lead QFN with 2 identical stacked dies for redundancy
180 nm BiCMOS

application-5

application-6

Applications (Automotive)

Absolute Rotary Position Sensor
Steering Wheel Position Sensor
Throttle and Valve Position Sensing
Motor-shaft Position Sensor
Gearbox Position Sensor
Tumble Flap
Chassis Height Level
Pedal Position Sensor
Float-Level Sensor
Contactless Potentiometers

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