An Application-Specific Integrated Circuit or ASIC is a customized integrated circuit designed specifically for a particular application. This means that a chip is created with a specific use or application in mind and may not be used for general purposes. Over the years, different types of ASICs have been developed for a wide range of industries—from telecommunications to photography.
A 3D imaging ASIC is designed specifically for use in 3D vision applications including those used for consumer devices like smartphones, tablets, laptops and personal computers. Let’s take a closer look at how 3D imaging works and the role of a 3D imaging ASIC in the process:
Technology Behind a 3D Imaging ASIC is Inspired by the Human Eye
Each of a human’s two eyes sees the world from different angles but they are perceived into one image through the brain combining these images into a whole, a process called parallax. This is pretty much the same with 2D imaging. But with 3D imaging, two lenses are used in every shot with each capturing an image that’s different from the other. This means that 3D images contain double the amount of information provided by 2D images.
3D imaging ASIC is Used in a Variety of Applications
3D imaging devices containing a 3D imaging ASIC can be used for a wide range of applications. This includes measuring, analyzing and positioning parts for different industrial uses. Each 3D imaging ASIC is designed to fit a specific industry or environment and 3D imaging systems use either active or passive methods. Active systems use methods like structured light or time of flight while passive methods utilize light field and depth from focus.
Active Snapshot and Laser Triangulation are also Used to Produce 3d shape Data
Snapshot-based methods and laser triangulation are both used to produce 3D shape data. In snapshot-based methods, the distance to objects is calculated by using the difference between two snapshots captured at the same time. This process is called passive stereo imaging.
One camera may be used for capturing these images but using two cameras make the process more efficient. Laser triangulation, on the other hand, uses one camera to derive height variations from laser patterns that are projected onto an object’s surface. Then, it observes how patterns moved when they are viewed from an angle using a camera.
Time is one of the Biggest Challenges in 3D Imaging
It is a known fact that creating 3D images is intensive and extremely time-consuming. This is why devices like a 3D imaging ASIC that can handle the complexity of calculations required especially in product lines to make the entire imaging process faster and more efficient.
The debate on whether 2D or 3D is better may still be up, but both technologies have proven beneficial to a wide range of industrial applications. At the end of the day, it’s all about how technology is used for a specific purpose, whether it’s using a 2d or 3D imaging ASIC.
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